| 单搭接接头峰值应力数值模拟的正交法分析 |
| |
| 引用本文： | 李智,游敏,郑小玲,余珊. 单搭接接头峰值应力数值模拟的正交法分析[J]. 中国胶粘剂, 2006, 15(11): 10-13 |
| |
| 作者姓名： | 李智 游敏 郑小玲 余珊 |
| |
| 作者单位： | 三峡大学机械与材料学院,湖北省,宜昌市,443002 |
| |
| 摘 要： | 运用正交试验法研究了几个主要力学和几何参数如泊松比,弹性模量和被粘物厚对单搭接接头Von Mises等效应力的影响。有限元分析结果的极差分析、方差分析和最优方案的工程平均等结果表明:被粘物厚对单搭接接头Von Mises等效应力影响最大,弹性模量次之,泊松比影响程度最小。分析可知:高的泊松比、低弹性模量和被粘物厚的增大会使得Von Mises等效应力值显著降低。
|
| 关 键 词： | 单搭接胶接接头 等效应力 峰值 正交试验 |
| 文章编号： | 1004-2849(2006)11-0010-04 |
| 收稿时间： | 2006-08-22 |
| 修稿时间： | 2006-08-22 |
The orthogonal test of numerical modeling on the peck stress distributed in single lap joint |
| |
| LI Zhi,YOU Min,ZHENG Xiao-ling,YU Shan. The orthogonal test of numerical modeling on the peck stress distributed in single lap joint[J]. China Adhesives, 2006, 15(11): 10-13 |
| |
| Authors: | LI Zhi YOU Min ZHENG Xiao-ling YU Shan |
| |
| Affiliation: | College of Mechanical and Material Engineering,China Three Gorges University,Yichang 443002,China |
| |
| Abstract: | The research is carried out with the method of orthogonal test to study the effects of some main parameters such as Poisson ratio,elastic modulus and adherend of thick on the peck value of the Von Mises equivalent stress distributed in adhesively bonded aluminium single lap joint. The results form elastic finite analysis as well as the range analysis,analysis of variance (ANOVA)and optimization project shown that the influence of adherend thickness is greatest among the three parameters on the peck value of Von Mises equivalent stress in single lap joint,the second is elastic modulus and the least is Poisson ratio. It is clear that increases adherend thickness or Poisson ratio as well as decreases the elastic modulus may decrease the peck value of Von Mises equivalent stress. |
| |
| Keywords: | adhesively bonded single lap joint Von Mises equivalent stress peck value orthogonal test |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
