Thermal and electrical properties of FeNi/Cu composites

Abstract

Powder metallurgy FeNi/Cu composites with low thermal expansivity and high electrical (thermal) conductivity were fabricated. The effects of Cu content, FeNi particle size, sintering temperature, and rolling reduction on the coefficient of thermal expansion (CTE) and electrical (thermal) resistivity were investigated. The results show that the CTE and electrical resistivity were affected by the volume fraction of the components, the particular properties of the FeNi alloy, diffusion between the FeNi particles and the Cu particles, and the distribution of the Cu particles and the FeNi particles. The experiments indicated that the FeNi/Cu composites could be used as heat sinks in welding type bolt silicon rectifier tubes.