Vacuum diffusion bonding of TiB2 cermet to TiAl based alloys

Abstract

Vacuum diffusion bonding of TiB₂ cermet to TiAl based alloys was carried out at 1123 – 1323 K for 0.6 – 3.6 ks under 80 MPa. The microstructural analyses indicate that a compound Ti(Cu, Al)₂ is formed in the interface of the TiB₂ /TiAl joints, and the width and quantity of the Ti(Cu, Al)₂ compound increase with the increase of the bonding temperature and bonding time. The experimental results show that the shear strength of the diffusion bonded TiB₂ /TiAl joint is 103 MPa, when TiB₂ cermet is bonded to TiAl based alloy at 1223 K for 1.8 ks under 80 MPa.