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一种宽带多通道瓦片式T/R组件的研制
引用本文:郝金中,张 瑜,周 扬. 一种宽带多通道瓦片式T/R组件的研制[J]. 电讯技术, 2015, 55(1): 108-112
作者姓名:郝金中  张 瑜  周 扬
作者单位:中国电子科技集团公司第十三研究所,石家庄,050051
摘    要:介绍了一种多通道瓦片式T/R组件的研制方法和关键技术。针对组件结构尺寸紧张、工作频率高且频带宽的要求,提出了一种新的高集成T/R组件三维立体组装方法,同时采用了多功能单片微波集成电路(MMIC)芯片技术、多芯片组装(MCM)技术提高集成度。通过对组件的热设计和密封性设计,确保了组件使用的长期可靠性。成功研制出尺寸为41.8 mm×8 mm×8.2 mm、质量不超过13 g的瓦片式T/R组件,具有4个收发通道,每个通道包含6位数控移相器和6位数控衰减器。该组件集成度高、散热性好、可靠性高,较传统T/R组件在尺寸和重量上具有突破性的优势,大大减小了雷达尺寸,使其更好地满足高性能共形有源相控阵雷达的需要。

关 键 词:共形有源相控阵雷达  T/R组件  宽带  多通道  瓦片式  三维立体组装

Design of a broadband multi-channel tile-type T/R module
HAO Jinzhong,ZHANG Yu and ZHOU Yang. Design of a broadband multi-channel tile-type T/R module[J]. Telecommunication Engineering, 2015, 55(1): 108-112
Authors:HAO Jinzhong  ZHANG Yu  ZHOU Yang
Affiliation:HAO Jinzhong;ZHANG Yu;ZHOU Yang;The 13th Research Institute of China Electronics Technology Group Corporation;
Abstract:Design method and key technologies of a tile-type T/R module are given.In order to meet the requirements of limited size,high operation frequency and wide bandwidth of the module,a new assembly method of three dimensional(3D) cubic packaging technology in the highly integrated packaging T/R module is proposed,and the multifunctional monolithic microwave integrated circuit(MMIC) chip technique and multi-chip module(MCM) technique are also adopted to increase the integration level.The long-term reliability of the module is ensured by the thermal design and the sealing design.Finally,a tile-type T/R module with the size of 41.8 mm×8 mm×8.2 mm and the weight less than 13 g has been developed successfully.The module has 4 receiver and transmitter channels,and each channel has a 6 bit phase shifter and a 6 bit attenuator.The tile-type T/R module features high integration level,good heat dissipation,high reliability and has more breakthrough advantages on the size and weight than the conventional T/R module.It also can reduce the size of radar to satisfy the requirement of high performance conformal active phased array radars.
Keywords:conformal active phased array radar  T/R module  wide bandwidth  multi-channel  tile-type  3 D cubic packaging
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