| 无卤印制电路板精冲模设计 |
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| 引用本文： | 李晨,高霖,刘剑超,史晓帆.无卤印制电路板精冲模设计[J].模具工业,2011(12):31-34. |
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| 作者姓名： | 李晨 高霖 刘剑超 史晓帆 |
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| 作者单位： | 南京航空航天大学; |
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| 摘 要： | 介绍了无卤印制电路板精冲复合模的设计,利用精冲原理抑制无卤印制电路板的裂纹扩展。模具利用聚氨酯橡胶和气缸提供精冲所需的反顶力,结构简单,且能在普通液压机上实现精冲加工。
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| 关 键 词： | 无卤印制电路板 基体开裂 纤维/基体分层 精冲 反顶力 |
Fine blanking die for halogen-free PCB |
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| LI Chen,GAO Lin,LIU Jian-chao,SHI Xiao-fan.Fine blanking die for halogen-free PCB[J].Die & Mould Industry,2011(12):31-34. |
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| Authors: | LI Chen GAO Lin LIU Jian-chao SHI Xiao-fan |
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| Affiliation: | LI Chen,GAO Lin,LIU Jian-chao,SHI Xiao-fan(Nanjing University of Aeronautics and Astronautics,Nanjing,Jiangsu 210000,China) |
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| Abstract: | The design of a fine blanking compound die for halogen-free PCB was presented.The principle of fine blanking was used to inhibit the crack growth of HF-PCB.The die ap plied polyurethane rubber and counterforce from cylinder for fine blanking.The die struc ture is simple and can be installed in general hydraulic press to achieve fine blanking. |
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| Keywords: | halogen-free printed circuit board(HF-PCB) matrix cracking fiber/matrix debonding fine blanking counterforce |
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