Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping technique |
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Authors: | J P Lucas F Guo J McDougall T R Bieler K N Subramanian J K Park |
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Affiliation: | (1) Department of Materials Science and Mechanics, Michigan State University, 48824-1226 East Lansing, MI |
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Abstract: | Creep deformation behavior was measured for 60–100 μm thick solder joints. The solder joints investigated consisted of: (a)
non-composite solder joints made with eutectic Sn-Ag solder, and (b) composite solder joints with eutectic Sn-Ag solder containing
20 vol. %, 5 μm diameter in-situ Cu6Sn5 intermetallic reinforcements. All creep testing in this study was carried out at room temperature. Qualitative and quantitative
assessment of creep deformation was characterized on the solder joints. Creep deformation was analyzed using a novel mapping
technique where a geometrical-regular line pattern was etched over the entire solder joint using excimer laser ablation. During
creep, the laser-ablation (LA) pattern becomes distorted due to deformation in the solder joint. By imaging the distortion
of laser-ablation patterns using the SEM, actual deformation mapping for the entire solder joint is revealed. The technique
involves sequential optical/digital imaging of the deformation versus time history during creep. By tracing and recording
the deformation of the LA patterns on the solder over intervals of time, local creep data are obtained in many locations in
the joint. This analysis enables global and localized creep shear strains and strain rate to be determined. |
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Keywords: | Sn-Ag solder creep deformation behavior Cu6Sn5 intermetallic reinforcements |
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