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铜基无氰电刷镀银研究
引用本文:黄登宇,邢志国,黄宪章.铜基无氰电刷镀银研究[J].电镀与精饰,2005,27(4):12-15.
作者姓名:黄登宇  邢志国  黄宪章
作者单位:山西大学,生命科学与技术学院,山西,太原,030006;运城学院,山西,运城,044000
摘    要:探讨了铜基无氰电刷镀银的基本原理和施镀工艺。详细介绍了电刷镀银设备、特点、应用以及手工除油、化学除油、电净、活化、浸银、刷镀银液的配制等前处理,防银变色处理、电解钝化、镀层性能检验、退镀、补镀、注意事项等后处理工艺。

关 键 词:无氰  铜基  电刷镀银
文章编号:1001-3849(2005)04-0012-04
修稿时间:2004年6月4日

Study on the Cyanide-Free Silver Brush Plating on Copper Substrate
HUANG Deng-yu,XING Zhi-guo,HUANG Xian-zhang.Study on the Cyanide-Free Silver Brush Plating on Copper Substrate[J].Plating & Finishing,2005,27(4):12-15.
Authors:HUANG Deng-yu  XING Zhi-guo  HUANG Xian-zhang
Abstract:Basic principle and technology of the cyanide free silver brush plating on copper substrates are researched. The pretreatments of substrates, such as the equipments, characteristics, applications, solution components, hand degreasing, chemical degreasing, electrolytic degreasing, activation, soaking substrates in silver plating bath, preparation of the bath, and the post-treatments of the silver coatings, such as the discoloration preventing treatment, electrolytic passivation, performance tests of the silver coating, stripping of the coatings, some notices etc., are introduced.
Keywords:cyanide-free  substrate of copper  silver brush plating
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