| 探究印制板焊锡冒泡的真正原因 |
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| 引用本文： | 沈锡宽 吴坚. 探究印制板焊锡冒泡的真正原因[J]. 电子工艺技术, 1998, 19(3): 95-98 |
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| 作者姓名： | 沈锡宽 吴坚 |
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| 作者单位： | 电子部十五所 |
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| 摘 要： | 通过铬铁焊模拟实验，找出制板锡焊时冒泡的真正原因，并提出解决办法。
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| 关 键 词： | 印制板 锡焊 冒泡原因分析 印制电路板 |
Exploring the Real Reason of Blowhole in PCB''''s Soldering |
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| Shen Xikuan Wu Jian. Exploring the Real Reason of Blowhole in PCB''''s Soldering[J]. Electronics Process Technology, 1998, 19(3): 95-98 |
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| Authors: | Shen Xikuan Wu Jian |
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| Affiliation: | Shen Xikuan Wu Jian |
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| Abstract: | This article finds out the real reason of blowhole in PCB's soldering by soldering test that was simulated with iron,and points out the solving methods |
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| Keywords: | Printed circuit board Soldering Reason amalysis of blowhole |
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