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Lapping of Single Crystal Diamond Tools
Authors:Z.J. Yuan  Y.X. Yao  M. Zhou  Q.S. Bal
Affiliation:Dept. of Mechanical Engineering, Harbin Institute of Technology, Harbin, 150001, China
Abstract:Lapping is the key technology used in manufacturing process of diamond tools and diamond Jewels. Because of the strong anisotropism and super hardness of diamond, the material removal rate is very small in its lapping process. The Influence of the crystal anisotropism on removal rate in diamond lapping is discussed in this paper. A new diamond crystal orientation method by using laser diffraction is presented, which can not only be used for the crystal orientation, but also for the indication of ‘soft’ directions on crystal planes in lapping. The mechanism of removal rate anisotropism in diamond lapping is investigated, and a new explanation for the reasons is proposed. It is pointed out that the variation of inclination angle between Inside (111) plane (cleavage plane) and lapping surface causes the difference of friction coefficient and removal rate in diamond lapping. Furthermore, a new method using ultrasonic vibration for diamond lapping was developed to improve the removal rate.
Keywords:Diamond   Lapping   Crystal plane
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