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T2紫铜箔材的U型弯曲变形
引用本文:王春举,郭斌,单德彬.T2紫铜箔材的U型弯曲变形[J].光学精密工程,2010,18(12):2610-2615.
作者姓名:王春举  郭斌  单德彬
作者单位:哈尔滨工业大学,材料科学与工程学院,黑龙江,哈尔滨,150001
基金项目:国家自然科学基金资助项目(No.50835002;50805035);中国博士后科学基金资助项目(No.20090460889);哈尔滨市创新人才基金资助项目(No.2008RFQXG041);微系统与微结构教育部重点实验室开放基金资助项目(No.HIT.KLOF.2009008)
摘    要:设计了箔板U型弯曲试验方案,使用不同凹模槽宽尺寸和圆角半径的微型模具,在三思微型试验机上完成了试验,分析了模具几何尺寸、箔板厚度等对箔板U型弯曲变形中冲头载荷、回弹以及表面质量的影响。研究结果表明,槽宽尺寸或圆角半径减小时,最大冲头载荷显著增加,且冲头载荷上升和下降速率都明显增大;对比两种不同厚度箔板的冲头载荷显示,冲头载荷减小速率明显快于横截面面积的减小速率,说明产生了明显的尺寸效应;另外,圆角半径或板厚减小,导致回弹角度增大,成形件精度降低;虽然成形件表面比较平整,但侧面出现划痕提示需要提高模具表面质量和采取润滑措施。以上研究结果对指导箔板微成形工艺设计具有重要意义。

关 键 词:紫铜箔材  微成形  U型弯曲  尺寸效应  回弹
收稿时间:2010-03-05
修稿时间:2010-05-28

U-bending process of T2 copper foil
WANG Chun-ju,GUO Bin,SHAN De-bin.U-bending process of T2 copper foil[J].Optics and Precision Engineering,2010,18(12):2610-2615.
Authors:WANG Chun-ju  GUO Bin  SHAN De-bin
Affiliation:School of Material Science and Engineering, Harbin Institute of Technology, Harbin 150001, China
Abstract:A U-bending test was designed by using a micro female mold with different groove widths and corner radii on a micro extension tester made by SANS company. The effects of the mold dimension and foil thickness on the maximum punch load, springback and surface quality were analyzed during the micro U-bending process. The results indicate that the reductions of groove width or radius leads to the increases of maximum punch load and the rates of increasing or decreasing of punch load increase greatly.By comparison of the punch loads of foils with different thicknesses,it is shown that the decreasing rate of punch load is larger than that of cross section area, and the size effect occurs obviously. Furthermore,the springback angle increases with the decreasing of thickness or radius, which reduces the accuracy of microparts. As the scratch appears at the side surface of a micro bending part, it suggests that the surface quality of the mold should be improved and the lubricating should be taken. The results have an important significance on the design of foil microforming process.
Keywords:copper foil  microforming  U-bending  size effect  springback
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