次品铜箔除杂与循环利用的研究

铜箔生产时大约有10％～30％的次品率，如果将次品铜箔直接返回溶铜工序，容易导致电解液杂质累积，影响铜箔质量，并且浪费电解液。为循环利用次品铜箔，必须要将次品铜箔加以处理以达到一级阴极铜的标准后再返回到溶铜工序。文章提出化学表面清洗解决方案并通过正交试验，研究化学表面清洗方式除去表面镀层杂质的最优化条件。

Study on the Removing Impurity and Recycling of Defective Copper Foil

The defective rate of copper foil production is about 10% -30%. If the defective copper foils return to the copper dissolve process directly, the electrolyte impurities will accumulate which affects the quality of copper foil and also is a waste of the electrolyte. In order to reuse the defective copper foils, it is necessary to take a process to make the defective copper foils achieve the cathode copper standard I before return to the copper dissolve process. This pa- per presents chemical surface cleaning solutions and conducts orthogonal experiments to study the optimum conditions of removing surface coating impurities by chemical surface cleaning methods.