电子元器件封装技术发展趋势

晶圆级封装、多芯片封装、系统封装和三维叠层封装是近几年来迅速发展的新型封装方式,在推动更高性能、更低功耗、更低成本和更小形状因子的产品上,先进封装技术发挥着至关重要的作用。晶圆级芯片尺寸封装(WCSP)应用范围在不断扩展,无源器件、分立器件、RF和存储器的比例不断提高。随着芯片尺寸和引脚数目的增加,板级可靠性成为一大挑战。系统封装(SIP)已经开始集成MEMS器件、逻辑电路和特定应用电路。使用TSV的三维封装技术可以为MEMS器件与其他芯片的叠层提供解决方案。

Emerging Trends in Packaging of Electronic Devices

WLP,MCP,SIP,3D stacked packaging are recently emerging packaging techniques.These new packaging types play the most important role in pushing the electronic devices to more excellent performance,lower power and lower cost.WCSP has a widely range of application,in which passive components,discrete devices,RF and storages have a high scale among the all components.SIP has integrated MEMS device,logic circuit and ASIC.3D packaging using TSV can provide stack solution for MEMS device and other chips.