| 废弃线路板中非金属材料再利用的研究进展 |
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| 引用本文： | 邱军,李娜,刘光富. 废弃线路板中非金属材料再利用的研究进展[J]. 工程塑料应用, 2011, 39(2): 91-95 |
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| 作者姓名： | 邱军 李娜 刘光富 |
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| 作者单位： | 邱军,李娜,Qiu Jun,Li Na(同济大学材料科学与工程学院,上海,200092);刘光富,Liu Guangfu(同济大学管理科学与工程学院,上海,200092) |
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| 摘 要： | 概述了废弃线路板中非金属材料主要是热固性塑料再利用的研究进展,主要针对非金属材料制成粉末作为填料或改性剂添加到热固性塑料、热塑性塑料中以降低塑料的生产成本或改善塑料的力学性能.或是将粉末作为高品质填料添加到建筑材料中,如增强沥青,生产高强、低密度的增强混凝土等的应用,在总结了各种回收再利用方法的基础上提出了未来废弃线路...
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| 关 键 词： | 废弃线路板 非金属材料 再利用 热固性塑料 |
PROGRESS IN RESEARCH OF REUSING OF NONMETALLIC MATERIALS IN WASTE PRINTED CIRCUIT BOARD |
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| Qiu Jun,Li Na,Liu Guangfu. PROGRESS IN RESEARCH OF REUSING OF NONMETALLIC MATERIALS IN WASTE PRINTED CIRCUIT BOARD[J]. Engineering Plastics Application, 2011, 39(2): 91-95 |
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| Authors: | Qiu Jun Li Na Liu Guangfu |
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| Affiliation: | Qiu Jun,Li Na(School of Materials Science and Engineering,Tongji University,Shang Hai 200092,China) Liu Guangfu(Institute of Management Science and Engineering,China) |
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| Abstract: | The reusing of the non-metallic materials in the waste printed circuit board,especially the reusing of the thermosetting resins was reviewed.The grinding non-metallic materials to powder as a filler and used as modifier added to the thermosetting resins or thermoplastic resins to reduce the production costs or to improve the mechanical properties were summarized in detail.The application of the material used as a filler added to the high-quality building materials,such as enhanced asphalt,production of high... |
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| Keywords: | waste printed circuit board nonmetallic materials reuse thermosetting resin |
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