| 基于CAD/CAE技术的电器外壳注射模具设计 |
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| 引用本文： | 贾建波,徐岩,王浩舟.基于CAD/CAE技术的电器外壳注射模具设计[J].工程塑料应用,2011,39(2):69-71. |
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| 作者姓名： | 贾建波 徐岩 王浩舟 |
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| 作者单位： | 北华大学机械工程学院,吉林,132021 |
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| 摘 要： | 以电器外壳为例,介绍了应用Moldflow和UG进行注射模具设计的流程.利用Moldflow/MPI对电器外壳进行充填和冷却分析,确定模具设计所需浇注系统、冷却系统等主要设计参数.应用UG完成分型设计、侧向分型与抽芯机构设计、注射模具的三维结构设计和二维工程图的转化.
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| 关 键 词： | 电器外壳 注射模具 Moldflow UG |
DESIGN OF INJECTION MOULD FOR ELECTRICAL ENCLOSURES BASED ON CAD/CAE TECHNOLOGY |
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| Jia Jianbo,Xu Yan,Wang Haozhou.DESIGN OF INJECTION MOULD FOR ELECTRICAL ENCLOSURES BASED ON CAD/CAE TECHNOLOGY[J].Engineering Plastics Application,2011,39(2):69-71. |
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| Authors: | Jia Jianbo Xu Yan Wang Haozhou |
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| Affiliation: | Jia Jianbo,Xu Yan,Wang Haozhou(School of Mechanical Engineering,Beihua University,Jilin 132021,China) |
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| Abstract: | Based on Moldflow and UG,the design of injection mould for electrical enclosures was exemplified.The filling and cooling analysis for electrical enclosures were simulated with the application of Moldflow/MPI.Main parameters of gating system and coolant system were obtained for injection mould design.Using UG,a series of jobs were completed,including parting surfaces design,side-parting and core-pulling mechanisms,3D structure of injection mould and 3D/2D conversion. |
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| Keywords: | Moldflow UG |
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