| 扩散连接中界面迁移机制研究 |
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| 引用本文： | 徐子文,阮中健,张桂林,黄正. 扩散连接中界面迁移机制研究[J]. 焊接技术, 2003, 32(1): 8-9 |
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| 作者姓名： | 徐子文 阮中健 张桂林 黄正 |
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| 作者单位： | 1. 北京航空航天大学,材料科学与工程学院,北京,1000833;华中科技大学,激光技术国家重点实验室,湖北,武汉,430063
2. 北京航空航天大学,材料科学与工程学院,北京,1000833 |
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| 基金项目： | 激光技术国家重点实验室开放基金资助项目([2001]0106)，航空基础科学基金资助项目(01H51004) |
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| 摘 要： | 发现并研究了扩散连接过程中3种主要界面迁移形式：I.化学诱发晶界迁移；Ⅱ.再结晶过程控制界面迁移；Ⅲ.超塑变形过程控制界面迁移。建立了一个球状生长物理模型来讨论扩散连接界面迁移中杂质的行为。并讨论了滞留界面的杂质对连接的断裂形貌和力学性能的影响。
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| 关 键 词： | 扩散连接 界面迁移机制 CIGM 杂质 超塑变形 |
| 文章编号： | 1002-025X(2003)01-0008-02 |
| 修稿时间： | 2002-06-26 |
Study on the mechanism of the boundary migration in diffusion bonding |
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| XU Zi-wen,,RUAN Zhong-jian,ZHANG Gui-lin,et al.. Study on the mechanism of the boundary migration in diffusion bonding[J]. Welding Technology, 2003, 32(1): 8-9 |
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| Authors: | XU Zi-wen RUAN Zhong-jian ZHANG Gui-lin et al. |
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| Affiliation: | XU Zi-wen1,2,RUAN Zhong-jian1,ZHANG Gui-lin1,et al. |
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| Abstract: | Three fundamental categories of boundary migrations in diffusion bonding were observed and discussed: I .Chemically Induced Grain Boundary Migration, II .Boundary Migration Controlled by Recrystallization, III .Boundary Migration Stimulated by Superplastic Deformation. A physical model of spheric-grain growth was set to describe the behavior of impurities during boundary migration in diffusion bonding. The influence of impurities stagnating in grain boundary on the fracture morphology and mechanical properties of bonds was discussed. |
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| Keywords: | diffusion bonding boundary migration mechanism |
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