导热高分子材料在包装印刷领域的研究进展

目的综述导热高分子材料在包装印刷领域的应用及研究现状,拓展导热高分子材料的应用领域。方法首先介绍2类导热高分子材料的制备方法,即本征型和填充型导热高分子材料;其次全面综述用于包装印刷领域的导热膜/纸、导热胶黏剂和导热油墨;最后总结常用的各类导热机理模型。结果与本征型导热高分子相比,填充型导热高分子具有加工简单、成本低廉、应用面广等优点,是目前研究最多的导热高分子材料。导热膜/纸、导热胶黏剂和导热油墨具有广泛的研究基础,市场需求旺盛。导热预测模型虽能够有效预测复合材料的热导率,但会受到填料含量和粒子形貌的影响。结论导热高分子材料在包装印刷领域拥有巨大的应用需求,开展导热高分子的研究具有重要的现实和理论意义。

Research Progress of Thermal Conductive Polymer Materials in Packaging and Printing

The paper aims to summarize the application of thermal polymer materials in packaging and printing to expand the application of thermal conductive polymer materials. Firstly, the preparation methods of two types of thermal conductive polymer materials, namely, intrinsic and filled thermal polymer materials, were introduced. Secondly, the thermal conductive film/paper, thermal conductive adhesive and thermal conductive ink used in packaging and printing were reviewed. Finally, the common types of thermal conductivity mechanism models were summarized. Compared with the intrinsic thermal polymer materials, the filled thermal polymer materials had the advantages of simple processing, low cost and wide application. It is the most researched thermal conductive polymer material at present. Thermal conductive film/paper, thermal conductive adhesive and thermal conductive ink had extensive research bases and strong market demand. The thermal conductivity prediction model can effectively predict the thermal conductivity of the composite, but it was affected by the filler content and particle morphology. Thermally conductive polymer materials have great application requirements in packaging and printing. It is of great practical and theoretical significance to research thermal conductive polymers.