木基免拆保温建筑模板制备及其性能研究

以木材加工剩余物碎料和自制无机胶粘剂为原料,通过热压工艺制备木基免拆保温建筑模板。研究了施胶量、热压时间、热压温度及板材密度对其性能的影响。结果表明,试验范围内,随着施胶量、密度的增大,木基免拆保温建筑模板的抗折强度、弹性模量、软化系数、导热系数逐渐增大,抗冻性能增强;随着热压温度、热压时间的增加,木基免拆建筑模板的抗折强度、弹性模量、软化系数先增大后减少,导热系数逐渐下降,抗冻性能先上升后下降。通过分析获得木基免拆保温建筑模板优化制板工艺参数:密度为0.9g/cm3,施胶量为65%,热压温度为120℃,热压时间为12min。

Studies on the performance and preparation of wood-based permanent formwork with thermal insulation

With wood processing residues and inorganic adhesives as raw materials, wood-based permanent formwork with thermal insulation was manufactured by hot-pressing technology. The effect of adhesives consumption, hot pressing time, hot pressing temperature and density on plate the board was studied. Results showed that thermal insulation flexural strength, elastic modulus, softening coefficient thermal conductivity and frost resistance of wood-based permanent formwork were gradually increased with increase of adhesives consumption and density. The thermal insulation flexural strength, elastic modulus, softening coefficient and frost resistance of wood-based permanent formwork firstly increase then decreased and thermal conductivity decreased with increase of hot pressing temperature and hot pressing time. Optimal process was as follows: density of 0.9 g/cm^3, adhesive consumption of 65%, hot-pressing temperature of 120 ℃, and hot-pressing time of 12 min.