电子封装用铜及银键合丝研究进展

随着电子封装高密度化、高速度化和小型化发展,金键合丝由于成本和性能等问题已不能满足要求。成本更加低廉的铜及银键合丝逐渐成为金丝替代品,但铜键合丝存在硬度高、易氧化、工艺复杂等问题,银键合丝存在抗拉强度低、Ag^+迁移和高温抗氧化抗性差等缺点。针对上述问题,广大学者进行了分析和研究,根据相关的文献、专利和产品,综述了铜及银键合丝的性能特点、成分设计、制备工艺、可靠性研究和性能改善方法,并对其发展前景进行了展望。

Research progress on copper and silver bonding wires for microelectronic packaging technology

With the development of high density,high speed and miniaturization in the electronic packaging industry,the gold bonding wire cannot meet the requirements due to cost and performance. Copper and silver bonding wires,which are cheaper,are gradually becoming a substitute for gold wire,but copper wires have problems,such as high hardness,easy oxidation,complicated process,etc. Silver wires have low tensile strength,Ag migration and poor high temperature oxidation resistance. In view of the above problems,the majority of scholars have carried out analysis and research. In this paper,the performance characteristics,composition design,preparation process,reliability research and performance improvement methods of copper and silver bonding wires according to related literatures,patents and products were reviewed and its development prospects were prospected.