| 电铸制备铜-石墨复合材料的研究 |
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| 引用本文： | 赵海军,刘磊,唐谊平,朱建华,胡文彬. 电铸制备铜-石墨复合材料的研究[J]. 材料工程, 2006, 0(5): 12-15 |
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| 作者姓名： | 赵海军 刘磊 唐谊平 朱建华 胡文彬 |
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| 作者单位： | 上海交通大学,金属基复合材料国家重点实验室,上海,200030 |
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| 基金项目： | 国家科技攻关项目 , 上海市科委资助项目 , 上海市科技发展基金 |
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| 摘 要： | 在酸性硫酸铜溶液中采用电铸技术制备了铜-石墨复合材料.表面活性剂、微粒浓度、电流密度和搅拌速度等工艺条件对微粒含量具有不同的影响.非离子表面活性剂对微粒共沉积具有较好的效果;随着微粒浓度增大,微粒含量也逐渐增大,最后趋于稳定值;电流密度增大使微粒含量降低;搅拌速度增大时微粒含量存在最大值.铜-石墨复合材料的硬度和摩擦系数随着微粒含量增大而减小,但是磨损量先是减小而后增大.摩擦过程中纯铜发生粘着磨损,铜-石墨复合材料却表现为剥层磨损.
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| 关 键 词： | 电铸 铜-石墨 金属基复合材料 摩擦 磨损 |
| 文章编号： | 1001-4381(2006)05-0012-04 |
| 收稿时间： | 2005-12-02 |
| 修稿时间： | 2006-03-12 |
Investigation on Cu-graphite Composites Prepared by Electroforming |
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| ZHAO Hai-jun,LIU Lei,TANG Yi-ping,ZHU Jian-hua,HU Wen-bin. Investigation on Cu-graphite Composites Prepared by Electroforming[J]. Journal of Materials Engineering, 2006, 0(5): 12-15 |
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| Authors: | ZHAO Hai-jun LIU Lei TANG Yi-ping ZHU Jian-hua HU Wen-bin |
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| Affiliation: | State Key Laboratory of Metal Matrix Composites, Shanghai Jiaotong University, Shanghai 200030, China |
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| Abstract: | Cu-graphite composites were prepared by electroforming technology in an acidic copper sulfate solution. The processing factors, such as surfactant, particle concentration, current density, agitation rate, had different effect on the volume fraction of graphite particles in the composites. Non-ionic surfactant improved the codeposition of graphite particles with copper matrix. With increasing graphite content in Cu-graphite composites, microhardness and friction coefficient decreased. However, wear mass loss decreased at the beginning, and then increased. During friction process adhesive wear occurred for pure copper, but delaminating wear occurred for Cu-graphite composites. |
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| Keywords: | electroforming Cu-graphite metal matrix composite friction wear |
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