| 半加成法工艺研究 |
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| 引用本文： | 黄勇,吴会兰,陈正清,苏新虹. 半加成法工艺研究[J]. 印制电路信息, 2013, 0(8): 9-13 |
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| 作者姓名： | 黄勇 吴会兰 陈正清 苏新虹 |
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| 作者单位： | 珠海方正印刷电路板发展有限公司,广东 珠海,519173 |
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| 摘 要： | 半加成法适合生产（10 m/10 m）50 m/50 m之间的精细线宽线距,目前主要有两种工艺:改良型半加成法和半加成法。本文主要探讨上述两种工艺实现方法,分析其关键工艺及业界前瞻性技术,最后对两种工艺进行对比。
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| 关 键 词： | 半加成法 改良型半加成法 线宽和线距 图形电镀 |
Study on Semi-additive Process Technology |
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| HUANG Yong , WU Hui-lan , CHEN Zheng-qing , SU Xin-hong. Study on Semi-additive Process Technology[J]. Printed Circuit Information, 2013, 0(8): 9-13 |
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| Authors: | HUANG Yong WU Hui-lan CHEN Zheng-qing SU Xin-hong |
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| Affiliation: | HUANG Yong, WU Hui-lan, CHEN Zheng-qing ,SU Xin-hong |
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| Abstract: | Semi-additive process is suitable for the production of fine line and space from10μm/10μm to 50μm/50μm.There are two main implementation processes： Modified Semi-additive process and Semi-additive process.In this paper,implementation methods of these two processes were discussed,the key technology and the industry outlook technology were analyzed,and finally the two processes were compared. |
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| Keywords: | Semi-Additive Process Modiifed Semi-Additive Process Line and Space Pattern Plating |
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