| 单面蚀刻型埋容PCB开发 |
| |
| 引用本文： | 杜红兵,袁继旺,吕红刚.单面蚀刻型埋容PCB开发[J].印制电路信息,2013(7):56-62. |
| |
| 作者姓名： | 杜红兵 袁继旺 吕红刚 |
| |
| 作者单位： | 东莞生益电子有限公司,广东 东莞,523039 |
| |
| 摘 要： | 应埋容PCB市场需求,采用C-Ply埋容材料制作单面蚀刻型平板埋容PCB;根据埋容材料特性、埋容工艺特点进行理论研究和生产验证,重点研究埋容层菲林补偿、埋容层层间对准度、电容值精度、埋容层可靠性、超薄材料过水平线等;最终开发出单面蚀刻型平板埋容PCB产品,并具备批量生产能力。
|
| 关 键 词： | 平板埋容PCB 陶瓷/环氧覆压延铜箔板 电容值精度 埋容层分层 薄&脆 批量生产 |
Development of single-side etching Embedded-Capacitance PCB |
| |
| DU Hong-bing
,
YUAN Ji-wang
,
LV Hong-gang.Development of single-side etching Embedded-Capacitance PCB[J].Printed Circuit Information,2013(7):56-62. |
| |
| Authors: | DU Hong-bing YUAN Ji-wang LV Hong-gang |
| |
| Affiliation: | DU Hong-bing, YUAN Ji-wang, LV Hong-gang |
| |
| Abstract: | C-ply Embedded-Capacitance PCB was developed to meet the market requirement.According to the process method and material character,theory research and batch verification were carried out.Capacitancevalue tolerance and Embedded-Capacitance-layer delamination about selecting FR4 material to match with C-ply were studied in detail.The proper process control and manufacturing standard of Embedded-Capacitance were also established.As a result,single-side etching Embedded-Capacitance PCB had been developed and could be put into mass production. |
| |
| Keywords: | Embedded-Capacitance PCB C-Ply Capacitance-Value Tolerance Embedded-Capacitance-Layer Delamination Thin-Brittle Mass-Yield |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
