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含羟基聚酰亚胺改性环氧胶的制备及性能研究
引用本文:徐永芬,虞鑫海,赵炯心,徐本科.含羟基聚酰亚胺改性环氧胶的制备及性能研究[J].热固性树脂,2013(2):26-29.
作者姓名:徐永芬  虞鑫海  赵炯心  徐本科
作者单位:东华大学化学化工与生物工程学院
基金项目:上海市科委项目(12521102002)资助
摘    要:将3,3'-二氨基-4,4'-二羟基联苯(DADHBP)、2,2-双(3-氨基-4-羟基苯基)六氟丙烷(BAH-PFP)和3,3',4,4'-四羧酸二苯醚二酐(ODPA)、3,3',4,4'-四羧酸二苯甲酮二酐(BTDA)单体聚合,再经亚胺化得到含羟基聚酰亚胺(HPI)粉末,采用傅里叶红外光谱对其进行了表征。由HPI、烯丙基双酚A、双马来酰亚胺、2-乙基-4-甲基咪唑与N,N,N',N'-四缩水甘油基-4,4'-二氨基二苯甲烷(TGDDM)共聚反应制得胶粘剂,并对胶粘剂的热性能、力学性能及吸水性进行了研究,结果表明:该胶拉伸剪切强度为21.1 MPa,固化后吸水率为0.49%。通过凝胶化时间法计算胶粘剂的表观活化能为64.5 kJ/mol。

关 键 词:含羟基聚酰亚胺  环氧树脂  胶粘剂  制备

Preparation and properties of hydroxyl-containing polyimide modified epoxy adhesive
XU Yong-fen,YU Xin-hai,ZHAO Jiong-xin,XU Ben-ke.Preparation and properties of hydroxyl-containing polyimide modified epoxy adhesive[J].Thermosetting Resin,2013(2):26-29.
Authors:XU Yong-fen  YU Xin-hai  ZHAO Jiong-xin  XU Ben-ke
Affiliation:(College of Chemistry,Chemical Engineering and Biotechnology,Donghua University,Shanghai 201620,China)
Abstract:The hydroxyl-containing polyimide(HPI) powder was prepared by copolymerization of 3,3′-diamino-4,4′-dihydroxybiphenyl(DADHBP),2,2-Bis(3-amino-4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropane(BAHPFP),3,3′,4,4′-tetracarboxylicdiphenylether dianhydride(ODPA) and 3,3′,4,4′-tetracarboxylicbenzophenone dianhydride(BTDA) and then imidization.The polyimide powder was characterized by FT-IR.The adhesive was prepared by copolymerization of HPI,bisallyl bisphenol A,bismaleimide,2-ethyl-4-methylimidazole and N,N,N′,N′-tetraglycidyl 4,4 ′-diamino diphenyl methane(TGDDM).The thermal properties,mechanical properties and water absorption of the adhesives were studied.The results showed that the tensile shear strength and water absorption of the cured adhesive were 21.1 MPa and 0.49%,respectively.The apparent activation energy was 64.5 kJ/mol calculated by the gel time method.
Keywords:hydroxyl-containing polyimide  epoxy resin  adhesive  preparation
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