Microstructure and mechanical properties predicted by indentation testing of lead-free solders

Microstructure and mechanical properties were investigated for ten systems of lead-free solders compared with the eutectic Sn-Pb solder. Mechanical properties including elastic, plastic, and creep deformations were predicted by indentation testing. This method was established based on the elastic-plastic-creep finite-element method (FEM). The predicted mechanical properties were obtained for the temperatures ranging between −20°C and 160°C.