Parameters affecting thermal fatigue behavior of 60Sn-40Pb solder joints |
| |
Authors: | D Frear D Grivas J W Morris |
| |
Affiliation: | (1) Sandia National LaboratoriesDivision 1832, P. O. Box 5800, 87185 Albuquerque, NM;(2) Lawrence Berkeley LaboratoryCenter for Advanced Materials, 1 Cyclotron Road 62-203, 94720 Berkeley, CA |
| |
Abstract: | Solder joints in electronic packages experience cyclical thermally induced strain when temperature fluctuations are encountered
in service. This study investigates three parameters that affect the microstructure and therefore the thermal fatigue behavior
of 60Sn-40Pb solder joints. These parameters are: 1) the effect of a tensile component in thermal fatigue, 2) solder joint
thickness variations, and 3) hold time variations at the elevated temperature portion of the thermal cycle. Solder joints
were thermally fatigued in a tension/compression deformation mode. Cracks developed both in the interfacial intermetallic
layer (early in thermal fatigue) and in the coarsened regions of the microstructure of the solder joint (after many more cycles).
The effect of joint thickness on solder joints thermally fatigued in shear was also explored. Solder joint thickness was found
not to significantly affect fatigue lifetimes. The effect of an increase in the hold time at the elevated temperature portion
of the thermal fatigue cycle was also investigated. It was found that time spent at the high temperature end of the fatigue
cycle does not determine solder joint lifetime, rather it is the combination of the amount of deformation induced during thermal
fatigue in concert with the elevated temperature. |
| |
Keywords: | 60Sn-40Pb solder thermal fatigue microstructure shear strain tensilestrain joint thickness |
本文献已被 SpringerLink 等数据库收录! |