| 电子工业用银包铜粉的制备现状及其应用 |
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| 引用本文： | 潘君益,朱晓云,郭忠诚,李国明,解祥生,黄峰.电子工业用银包铜粉的制备现状及其应用[J].电镀与涂饰,2006,25(6):49-53. |
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| 作者姓名： | 潘君益 朱晓云 郭忠诚 李国明 解祥生 黄峰 |
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| 作者单位： | 1. 昆明理工大学材料与冶金工程学院,云南,昆明,650093
2. 昆明理工恒达科技有限公司,云南,昆明,650167 |
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| 摘 要： | 综述了制备银包铜粉各种方法的制备工艺及银包铜粉性能的研究现状,这些方法包括置换法、化学还原法、置换与化学沉积复合法及熔融雾化法。介绍了铜粉的预处理方法。列出了某单位采用置换与化学沉积复合技术制备的7种不同银含量的片状银包铜粉的技术指标。指出了银包铜粉的用途及其应用前景。
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| 关 键 词： | 电子工业 银包铜粉 置换 化学还原 化学沉积 熔融雾化 预处理 银含量 |
| 文章编号： | 1004-227X（2006）06-0049-05 |
| 收稿时间： | 2005-09-05 |
| 修稿时间： | 2005-09-05 |
Preparation status and applications of silver-coated copper powder used in electronics industries |
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| PAN Jun-yi,ZHU Xiao-yun,GUO Zhong-cheng,LI Guo-ming,XIE Xiang-sheng,HUANG Feng.Preparation status and applications of silver-coated copper powder used in electronics industries[J].Electroplating & Finishing,2006,25(6):49-53. |
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| Authors: | PAN Jun-yi ZHU Xiao-yun GUO Zhong-cheng LI Guo-ming XIE Xiang-sheng HUANG Feng |
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| Affiliation: | Faculty of Materials and Metallurgical Engineering, Kunming University of Science and Technology , Kunming 650093 , China |
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| Abstract: | The study status on the preparation process of various methods to prepare silver-coated copper powder and the powder's properties were overviewed. These methods include replacement,chemical reduction, replacement in combination with chemical deposition, melting atomization. The pretreatment method of copper powder was introduced.The technical indexes of seven kinds of flaked silver-coated copper powder with different silver content were listed, and all the powder was obtained by method of replacement in combination with chemical deposition. The applications and prospect of silver-coated copper powders were also proposed. |
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| Keywords: | electronics industry silver-coated copper powder replacement chemical reduction chemical deposition melting atomization pre-treatment silver content |
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