高强高模聚酰亚胺纤维/改性氰酸酯树脂复合材料制备及性能

以4，5-环氧己烷-1，2-二甲酸二缩水甘油酯（TDE-85）、苯基缩水甘油醚（PGE）、壬基酚（NP）作为改性剂改性双酚A氰酸酯（BCE）得到改性氰酸酯树脂（TPNCE），通过湿法缠绕制备预浸料，并采用热压罐成型工艺制备S30M型高强高模聚酰亚胺纤维/TPNCE（PI/TPNCE）复合材料，对TPNCE树脂及PI/TPNCE复合材料的介电、力学等性能进行了分析。结果表明，TPNCE树脂冲击强度达到14.2 kJ/m2，比BCE提高近一倍，固化温度下降了约43℃，与PI纤维界面结合较好，且保持较低的介电常数和介电损耗；PI/TPNCE复合材料0°拉伸强度达到1 485 MPa，弯曲强度达到758 MPa，压缩强度达到322 MPa，7~18 GHz范围内介电常数保持在3.15左右，介电损耗因子在0.005~0.0075之间，玻璃化转变温度为197℃，密度为1.28 g/cm3。本研究实现了高强高模PI纤维与氰酸酯树脂复合的重要突破，为轻质高强结构-功能一体化复合材料的设计和选材提供了新思路。 

Preparation and properties of high strength and high modulus polyimide fiber/modified cyanate resin composites

The bisphenol A cyanate ester(BCE)was modified by 4,5-epoxyhexane-1,2-dicarboxylic acid diglycidyl ester(TDE-85),phenyl glycidyl ether(PGE)and nonylphenol(NP)(TPNCE),and high strength and high modulus polyimide fiber/TPNCE(PI/TPNCE)composites were prepared by wet winding and autoclave molding process.The mechanical properties and dielectric properties of TPNCE resin and PI/TPNCE composites were analyzed.The results show that the impact strength of TPNCE resin reaches 14.2 kJ/m2,which is nearly double that of the BCE.Compared with the unmodified system,the TPNCE resin keep excellent dielectric properties,the curing temperature drops by about 43℃,and the interface is better with PI fiber.In addition,the PI/TPNCE composite has 0°tensile strength of 1485 MPa,bending strength of 758 MPa,compressive strength of 322 MPa,dielectric constant of about3.15 and dielectric loss factor of 0.005-0.0075 at 7-18 GHz.The glass transition temperature of PI/TPNCE composite is 197℃ and density is 1.28 g/cm3.This study realizes an important breakthrough in the combination of high-strength and high-modulus PI fiber and cyanate ester,and provides a new idea for the design and material selection of lightweight high-strength structural-functional integrated composites.