超高转速等离子旋转电极工艺制备钬铜球形粉末的研究

采用超高转速等离子旋转电极工艺(supreme-speed plasma rotating electrode process, SS-PREP)制备韧性金属间化合物钬铜(HoCu)球形粉末, 粉末粒度在15~106μm之间。利用X射线衍射仪、扫描电子显微镜、能谱分析及光学显微镜分析了SS-PREP钬铜球形粉末的粒度分布、松装密度、振实密度及霍尔流速等粉末特性, 比较了不同试验方法对粒度分布的表征。结果表明, SS-PREP钬铜粉末主要由CsCl结构的RM型B2相构成, 不同粒度的HoCu球形颗粒化学成分基本一致, 随着粉末粒度增大, HoCu球形粉末的非球形颗粒比例呈现下降趋势。

Study of the spherical HoCu powders prepared by supreme-speed plasma rotating electrode process

The spherical HoCu powders as the ductile intermetallic compounds were prepared by the supreme-speed plasma rotating electrode process (SS-PREP) with the particle sizes of 15~106 μm without sieving. The particle size distribution, apparent density, tap density, and Hall flowability of the SS-PREP HoCu powders were investigated by X-ray diffraction (XRD), scanning electron microscope (SEM), energy disperse spectroscope (EDS), and optical microscope (OM). The particle size distribution characterized by the different test methods were compared and analyzed. The results show that, all of the SS-PREP HoCu powders consist of B2 phase in RM style with CsCl structure; the chemical compositions of HoCu powders in different particle sizes remain nearly constant; with the increase of powder sizes, the proportion of non-spherical HoCu particles decrease.