A Paradigm of Carbon Nanotube Interconnects
in Microelectronic Packaging |
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| Authors: | Yangyang Sun Lingbo Zhu Hongjin Jiang Jiongxin Lu Wei Wang CP Wong |
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| Affiliation: | (1) School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA;(2) School of Chemistry and Biochemistry, Georgia Institute of Technology, Atlanta, GA 30332, USA;(3) School of Chemical and Biomolecular Engineering, Georgia Institute of Technology, Atlanta, GA 30332, USA |
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| Abstract: | Carbon nanotube (CNT) arrays/films were transferred onto copper substrates via eutectic tin/lead (SnPb) solder pastes. The
morphologies, thermal stabilities, adhesion to substrates, and electrical properties of the as-transferred CNT arrays were
studied. The CNT arrays generated negligible expansion or contraction below 250°C. The adhesion of CNT arrays to the substrate
was significantly improved by the transfer process. An ohmic contact was formed between the transferred CNT arrays and the
Sn-Pb solder. Four-probe electrical measurements yielded the resistance of the as-transferred CNT films under the electrode
to be around 0.0056 Ω, from which the resistivity of each individual CNT tube was calculated to be 2.44 × 10−4 Ω cm. |
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| Keywords: | Carbon nanotubes transfer interconnect ohmic contact |
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