| 引入模块化概念的贴装设备 |
| |
| 引用本文： | 胡志勇.引入模块化概念的贴装设备[J].电子工业专用设备,2004,33(5):70-72. |
| |
| 作者姓名： | 胡志勇 |
| |
| 作者单位： | 华东计算技术研究所,上海,201800 |
| |
| 摘 要： | 向模块化组装生产线方向发展正获得愈来愈多人们的关注。一条由多种“高速模块”所组成的生产线具有许多优点,将对现有的装配厂商具有很大的诱惑力。由高速柔性化贴装设备所组成的组装生产线可以超越传统的芯片射手和微细间距贴装设备。
|
| 关 键 词： | 模块化 电子装配 表面贴装 贴装设备 |
| 文章编号： | 1004-4507(2004)05-0070-03 |
| 修稿时间： | 2003年10月23 |
The Placement Machines with Concept of Modular Assembly |
| |
| HU Zhi-yong.The Placement Machines with Concept of Modular Assembly[J].Equipment for Electronic Products Marufacturing,2004,33(5):70-72. |
| |
| Authors: | HU Zhi-yong |
| |
| Abstract: | The movement toward modular assembly lines is gaining momentum. The benefits of a line made up of multiple "high speed flexible" modules would have an immediate impact on assemblers. Assembly lines comprised of high speed flexible placement machines may well rival the traditional chipshooter/fine pitch placement machines. |
| |
| Keywords: | Modular Electronic Assembly Surface Mount Placement Machine |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
