| 宽禁带半导体材料清洗技术研究 |
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| 引用本文： | 张瑾,杜海文. 宽禁带半导体材料清洗技术研究[J]. 电子工艺技术, 2006, 27(4): 212-214,217 |
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| 作者姓名： | 张瑾 杜海文 |
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| 作者单位： | 中国电子科技集团公司第二研究所,山西,太原,030024 |
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| 摘 要： | 随着半导体技术的不断发展,新材料的使用,对晶片表面质量的要求也越来越高,传统的RAC清洗方法已不能满足其需求,因此,必须发展新的清洗方法.简要介绍了宽禁带半导体材料的特性与应用.并针对其材料的清洗提出了一些工艺方法与改进的方式.
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| 关 键 词： | 宽禁带 半导体 清洗 |
| 文章编号： | 1001-3474（2006）04-0212-04 |
| 收稿时间： | 2005-06-05 |
| 修稿时间： | 2005-06-05 |
Study of Cleaning Technology for Wide-Bandgap Materials |
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| ZHANG Jin,DU Hai-wen. Study of Cleaning Technology for Wide-Bandgap Materials[J]. Electronics Process Technology, 2006, 27(4): 212-214,217 |
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| Authors: | ZHANG Jin DU Hai-wen |
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| Affiliation: | CECT No. 2 Research Institute, Taiyuan 030024, China |
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| Abstract: | Along with the development of semiconductor technologies and materials,the demand of wafer surface quality becomes more and more critical.Traditional RCA cleaning can not satisfy the demand.Therefore,new cleaning technologies should be explored.Introduce the characteristics and applications of the wide-bandgap materials.And aim at the cleaning of the materials,put forward some technologies and improved methods. |
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| Keywords: | Wide-bandGap Semiconductor Cleaning |
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