单片光电集成电路的激光微细加工装置的改进

将激光微细加工“直接写入”、“低温处理”的优势,应用于单片光电集成电路(OEIC)的制作,有利于解决其中的光电兼容问题。详细介绍了本课题组多年来在激光微细加工制作领域方面所取得的进展,完善了实验系统,包括硬件平台的搭建和改进、软件的设计,并最终形成了以计算机为核心的集光机电为一体的自动控制系统,减少了由于人为因素的影响而带来的实验误差,为激光微细加工制作出性能优越的器件创造了前提条件。同时对激光微细加工中的温度这一关键工艺参数进行了大量的理论分析和实验研究,主要包括温度的测量、温度变化规律的分析以及由此对温度参数进行控制的理论分析和研究,取得了进展,提高了激光微细加工的精度并已实际应用于InGaAs/InP平面型PIN光探测器的制作。

Improving of the Equipment of Laser Assisted Microprocessing Used in OEICs

With the advantages of “direct access” and “low-temperature process”, laser-assisted microprocessing can be used in the fabrication of OEICs to realize the optoelectronic compatibility. The achievements which our team has arrived at in the field of laser-assisted microprocessing are presented in this paper. Firstly, the experimental system has been improved, including the hardware platform's building and improving, and the software's designing, and finally developed into an automatic control system with the computer as the core and with optics, mechanism and electronics incorporated. Thus, the amount of experimental errors caused by human factors is decreased and the superior performance devices are accessible through laser assisted microprocessing. Meanwhile, a substantial theoretical analysis and experiments have been done on temperature, a key parameter of laser assisted microprocessing,which mainly includes the measurement of temperature, the analysis of the regularity for change of temperature and the study of the controlling of temperature. Consequently, the accuracy of laser-assisted microprocessing has been improved and the technology has been used for the planar InGaAs/InP PIN photodiode's fabricating.