| QFN焊盘设计及工艺组装 |
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| 引用本文： | 年晓玲. QFN焊盘设计及工艺组装[J]. 电子质量, 2010, 0(5): 39-41 |
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| 作者姓名： | 年晓玲 |
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| 作者单位： | 中国电子科技集团公司第四十一研究所,安徽,蚌埠,233006 |
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| 摘 要： | 随着电子产品向更轻、更薄、更小、高密度化和高可靠性的发展,QFN（方形扁平无引脚）封装由于具有良好的电和热性能、体积小、质量轻,在电子产品中被越来越广泛的推广和应用。文章对QFN器件的焊盘设计,网板设计及组装工艺作了详细的介绍。
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| 关 键 词： | QFN焊盘设计 网板设计 焊膏涂覆 回流焊温度曲线 焊点检测 |
QFN Bonding Pad Design and Process Assembly |
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| Nian Xiao-ling. QFN Bonding Pad Design and Process Assembly[J]. Electronics Quality, 2010, 0(5): 39-41 |
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| Authors: | Nian Xiao-ling |
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| Affiliation: | Nian Xiao-ling( The 41st Institute of CETC, Anhui Bengbu 233006) |
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| Abstract: | With electronic products getting lighter, thinner, smaller, high density and high reliability, QFN （Quad Flat and no- lead） package has been widely promoted and applied in the electronic products because of its good electrical and thermal performance, small volume and light weight. In this article, bonding pad design, stencil design and assembly process of QFN device will be intro- duced in detail. |
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| Keywords: | QFN bonding pad design stencil design solder paste coating temperature curve of solder-reflow welding spot inspec-tion |
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