首页 | 本学科首页   官方微博 | 高级检索  
     


About the validity of analytical approximations for temperature and stress for actively cooled windows during thermal loading
Authors:OV Ogorodnikova
Affiliation:Forschungszentrum Juelich, EURATOM-Association, Institut für Werkstoffe und Verfahren der Energietechnik 2, D-52425 Jülich, Germany
Abstract:The verification of analytical approximations for temperature and stresses during thermal loading is done for ceramic edge-cooled windows for the stellarator W7-X by comparison with more accurate numerical calculations. Numerical calculations show that a steady state temperature and stress approximations assuming edge-cooled circular plates can be applied only in the case when radiative cooling from a surface is neglected. The prediction for poor thermal conductivity ceramics under high heat flux load based on simple analytical equations can result in considerable mistakes in the temperature and, consequently, stress values. Even the prediction of the qualitative tendency of temperature and stress behaviour as a function of the window size can be wrong.
Keywords:C0300  M0300  T0600
本文献已被 ScienceDirect 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号