Cu—Ti合金原位生成TiB2颗粒时的组织演变

通过原位生成反应，采用Cu-3．4％Ti和Cu-0．7％B中间合金，利用快速凝固技术制备纳米TiB，颗粒增强块体Cu—Ti合金，然后对合金在900℃进行热处理l～10h。高分辨透射电镜（HRTEM）观察表明，在铜熔体中，Ti和B通过原位反应生成初始纳米TiB2颗粒和TiB晶须，TiB晶须的生成会导致TiB2颗粒粗化。初始TiB2颗粒沿晶界分布，会阻碍晶粒在高温下的生长。在对合金进行热处理时，晶粒内的Ti和B原子通过扩散反应生成二次TiB2颗粒。对合金热处理前后的导电率和硬度进行测试。结果显示，生成的二次TiB2颗粒能够延缓合金在高温下硬度的下降，合金的电导率和硬度随着热处理时间的延长而增加，在处理8h时分别为33．5％IACS和HVl58。

Microstructural evolution of copper-titanium alloy during in-situ formation of TiB2 particles

Bulk Cu-Ti alloy reinforced by TiB2 nano particles was prepared using in-situ reaction between Cu 3.4%Ti and Cu-0.7%B master alloys along with rapid solidification and subsequent heat treatment for 1-10 h at 900 ℃. High-resolution transmission electron microscopy （HRTEM） characterization showed that primary TiB2 nano particles and TiB whiskers were formed by in-situ reaction between Ti and B in the liquid copper. The formation of TiB whiskers within the melt led to coarsening of TiB2 particles. Primary TiB2 particles were dispersed along the grain boundaries and hindered grain growth at high temperature, while the secondary TiB2 particles were formed during heat treatment of the alloy by diffusion reaction of solute titanium and boron inside the grains. Electrical conductivity and hardness of the composite were evaluated during heat treatment. The results indicated that the formation of secondary TiB2 particles in the matrix caused a delay in hardness reduction at high temperature. The electrical conductivity and hardness increased up to 8 h of heat treatment and reached 33.5% IACS and HV 158, respectively.