双层微齿轮型腔镶块电铸均匀性 Ansys 模拟与优化

目的提高双层微齿轮模具型腔镶块电铸过程中铸层的均匀性。方法利用Ansys对双层微齿轮型腔镶块电铸过程中电场强度的分布情况进行模拟,确定施加绝缘挡板的可行性。采用正交试验考察绝缘挡板几何及位置尺寸对电场强度的影响,应用灰关联理论得出最优工艺参数组合。结果绝缘挡板的施加,在一定条件下可以使光刻胶电铸层厚度更为均匀和平整。路径a的相对误差由62.48%降低到33.18%,路径b的相对误差由48.01%降低到8.91%。结论施加绝缘挡板可以提高双层微齿轮模具型腔镶块电铸过程中铸层的均匀性。

Ansys Simulation and Optimization of Electroforming Uniformity of Double Micro Gear Insert Block

Objective To improve the electroforming uniformity of double micro gear die cavity inserts in the process of electroforming. Methods First of all, the electric field intensity distribution on the double micro gear cavity inserts in the electroforming process was simulated with Ansys, and the method of applying insulating baffle was proved to be feasible. Second, the effects of insulating baffle geometry and position size on the electric field intensity was investigated using the orthogonal experiment method. Finally, the application of grey theory was used in finding the optimal combination of process parameters. Results Ansys simulation results showed that the application of insulating baffle under certain conditions could increase the uniformity and evenness of the thickness of photoresist electroforming layer. The relative error of path a was reduced from 62. 48% to 33. 18% . The relative error of path b was reduced from 48. 01% to 8. 91% . Conclusion By applying insulating baffle, the uniformity of the cast layer was improved during the electroforming process of double micro gear die cavity inserts.