| 化学镀法制备Cu/Al2O3复合粉体及其烧结行为 |
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| 引用本文： | 曲彦平,王鹏,闫平.化学镀法制备Cu/Al2O3复合粉体及其烧结行为[J].表面技术,2009,38(4):50-52,77. |
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| 作者姓名： | 曲彦平 王鹏 闫平 |
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| 作者单位： | 沈阳工业大学材料科学与工程学院,辽宁,沈阳,110178;沈阳铸造研究所,辽宁,沈阳,110022 |
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| 摘 要： | 为了解决颗粒增强铜基复合材料中颗粒与铜基体相容性的问题,采用化学镀法使得颗粒表面金属化,通过XRD、SEM、EDS等技术研究了Al2O3纳米粉化学镀铜的工艺,并对Cu/Al2O3复合粉体的烧结行为做了初步探讨.结果表明:Al2O3粉前处理工艺、镀液的各种成分都对粉体表面铜的含量有影响,通过改变装载量可有效控制粉体表面Cu含量.实验中确定了最佳的镀覆工艺,并得到了颗粒较为弥散的Cu/Al2O3复合粉体烧结体.
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| 关 键 词： | 铜基复合材料 化学镀铜 纳米Al2O3 铜含量 烧结体 |
Preparation and Sintering Behavior of Cu-Al2O3 Nano-composite Powders by Electroless Copper Plating |
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| QU Yan-ping,WANG Peng,YAN Ping.Preparation and Sintering Behavior of Cu-Al2O3 Nano-composite Powders by Electroless Copper Plating[J].Surface Technology,2009,38(4):50-52,77. |
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| Authors: | QU Yan-ping WANG Peng YAN Ping |
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| Affiliation: | QU Yan-ping1,WANG Peng1,YAN Ping2(1.School of Materials Science , Engineering,Shenyang University of Technolog,Shenyang 110178,China,2.Shenyang Research Institute of Foundry,Shenyang 110022,China) |
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| Abstract: | In order to solve the problem of consistence between particles and particle-reinforced copper-based composite,electroless plating was used to make the particle surface metallization.The technology of electroless copper plating on the surface of nano-Al2O3 was studied and the sintering behavior of Cu/Al2O3 nano-composite powders was discussed by XRD,SEM,EDS,etc.The results show that Al2O3 powder pre-treatment process and the various components of bath have effects on the Cu content of the surface of powder.T... |
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| Keywords: | Copper matrix composite Electroless copper plating Nano-Al2O3 Copper content Sinter |
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