| 高性能印制线路板设计的工程实现 |
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| 引用本文： | 占国华. 高性能印制线路板设计的工程实现[J]. 计算机工程, 2008, 34(Z1) |
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| 作者姓名： | 占国华 |
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| 作者单位： | 华东计算技术研究所,上海,200233 |
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| 摘 要： | 电子产业在摩尔定律的驱动下,产品的功能越来越强,集成度越来越高,信号的速率越来越快,产品的研发周期也越来越短,印制线路板(PCB)的设计随之进入了高速PCB设计时代.PCB不再仅仅是完成互连功能的载体,而是作为所有电子产品中一个极为重要的部件.该文从高性能PCB设计的工程实现角度出发,通过对PCB设计技术要点、设计思想以及业界EDA工具的概述,系统地介绍了PCB设计所需的相关技术.
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| 关 键 词： | 印制线路板设计 性能 EDA工具 |
Engineering Implementation of High Performance PCB Design |
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| ZHAN Gno-hua. Engineering Implementation of High Performance PCB Design[J]. Computer Engineering, 2008, 34(Z1) |
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| Authors: | ZHAN Gno-hua |
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| Affiliation: | ZHAN Guo-hua (East China Institute of Computer Technology,Shanghai 200233) |
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| Abstract: | Following the Moore's law,the products in the electronics industry tend to be more powerful,complicate,with a higher integration level,higher speed and shorter R&D cycle.Printed Circuit Board(PCB) design meets a booming age of high-speed PCB design.PCB is not only a carrier to realize the interconnection,but also a very important component for all of the electronics products.With an overview of high-performance PCB design. |
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| Keywords: | Printed Circuit Board(PCB) design performance EDA tools |
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