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Metallurgically and mechanically reliable microsilver-sintered joints for automotive power module applications |
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| Authors: | Yoon Jeong-Won Back Jong-Hoon |
| Affiliation: | 1.Department of Advanced Materials Engineering, Chungbuk National University, 1 Chungdae-ro, Seowon-gu, Cheongju, 28644, Chungbuk, Korea ;2.Welding and Joining R&D Group, Korea Institute of Industrial Technology (KITECH), 156 Gaetbeol-ro, Yeonsu-gu, Incheon, 21999, Korea ; |
| Abstract: | Journal of Materials Science: Materials in Electronics - Conventional soldering methods with Pb-containing and Pb-free solder alloys have been extensively used in the manufacturing of the power... |
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