Manufacture of 3D structures by cold low pressure lamination of ceramic green tapes |
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| Authors: | Karin Schindler Andreas Roosen |
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| Affiliation: | 1. School of Physics and Optoelectronic Engineering, Ludong University, Yantai 264025, China;2. School of Science, Beijing Jiaotong University, Beijing 100044, China;3. Condensed Matter Science and Technology Institute, School of Science, Harbin Institute of Technology, Harbin 150080, China;4. Department of Physics, College of Science, Huazhong Agricultural University, Wuhan 430070, China;5. SDCU Key Laboratory of Molecular Design and Materials Synthesis, School of Physics and Optoelectric Engineering, Ludong University, Yantai 264025, China;1. Department of Mechanical and Aerospace Engineering, New Mexico State University, Las Cruces, NM, USA;2. Center for Design, Manufacturing, and Materials, Skolkovo Institute of Science and Technology, Skolkovo, Russia;1. Hubei Provincial Key Laboratory of Green Materials for Light Industry, Hubei University of Technology, Wuhan 430068, China;2. School of Materials and Chemical Engineering, Hubei University of Technology, Wuhan 430068, China |
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| Abstract: | 3D multilayer devices were generated by Laminated Object Manufacturing (LOM), a well-known rapid-prototyping technology. Divergent from this method, commercial ceramic green tapes were used which were laminated by Cold Low Pressure Lamination (CLPL). In contrast to thermo-compression, which works at pressures and elevated temperatures, CLPL allows to join particularly fine, complex structures with cavities or undercuts, because no mass flow occurs. This technique is based on gluing the adjacent tapes by means of an adhesive film at room temperature under a low pressure. After binder burnout and sintering the ceramic laminate has a homogenous and dense microstructure free of interfaces. This modified LOM technique is particularly suitable for the production of Micro Electro Mechanical Systems (MEMS).In the given paper commercial Low Temperature Co-fired Ceramic (LTCC) green tapes were used, which were structured by means of a high-frequency milling plotter and laminated by using CLPL. Various 3D devices of different shape with inlying cavities were manufactured. The quality of the fired and unfired structures of the devices were characterised by different methods and show a high quality surface of the multilayer structures. Process aspects of the CLPL technique are discussed. The results demonstrate the advantages of this method for the fabrication of MEMS. |
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