Novel cold chemical lamination bonding technique—A simple LTCC thermistor-based flow sensor |
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| Authors: | D Jurków L Golonka |
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| Affiliation: | 1. NUS Graduate School for Integrative Sciences and Engineering, National University of Singapore, 117456 Singapore, Singapore;2. Department of Electrical and Computer Engineering, National University of Singapore, 117583 Singapore, Singapore;3. Siemens Corporation, Corporate Research and Technology, Princeton, NJ 08540, USA;1. G.A. Razuvaev Institute of Organometallic Chemistry of Russian Academy of Sciences, Tropinina 49, GSP–445, 603950 Nizhny Novgorod, Russia;2. Center for Magnetic Resonance, Research Park, Saint Petersburg State University, Universitetskiy pr. 26, Petrodvoretz, Saint Petersburg 198504, Russia;3. Research Center of Nanobiotechnologies, Peter the Great St. Petersburg Polytechnic University, Polytechnicheskaya, 29, Saint Petersburg 195251, Russia;4. Saint Petersburg State Forest Technical University, Institutsky per., 5, Saint Petersburg 19402, Russia;5. Institute of Chemistry, Saint Petersburg State University, Universitetskaya nab. 7/9, Saint Petersburg 199034, Russia;1. School of Chemistry, Shoolini University, Solan 173212, Himachal Pradesh, India;2. Department of Environmental Sciences, Central University of Jammu, Bagla (Rahya-Suchani), Distt. Samba, Jammu & Kashmir, 181143, India;3. Nanotechnology and Water Sustainability Research Unit, College of Science, Engineering and Technology, University of South Africa, Florida Campus, Johannesburg, South Africa;1. Technical University of Munich, Department of Chemistry, Lichtenbergstraße 4, 85748 Garching b. München, Germany;2. Technical University of Munich, Catalysis Research Center, Ernst-Otto-Fischer-Straße 1, 85748 Garching b. München, Germany |
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| Abstract: | The LTCC technique enables fabrication of microfluidic devices. The structures consist of channels, chambers and screen-printed passives. The lamination is a quality-determining process in the manufacture of the fluidic modules. The commonly used bonding method is thermocompression. The tapes are joined together at high pressure (up to 30 MPa) and temperature (up to 80 °C) for 2–15 min. Although these parameters allow good LTCC module encapsulation, the quality of the chamber geometry is strongly affected by high pressure and temperature. The cold chemical lamination (CCL) technique presented in this paper, a solvent-based method, largely avoids these problems. A film of a special solvent is deposited on the green tape, and softens the surface. The tape layers are then stacked and compressed at low pressure, below 100 kPa, at room temperature. The fabrication of a simple LTCC thermistor-based flow sensor is presented here to compare both lamination methods. The test device consists of one buried thermistor screen printed on a bridge hanging in a gas/liquid channel. The basic sensor parameters (measurement range, working temperature, output signal, working pressure and measurement error) are analyzed. |
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