| 光刻、OPC与DFM |
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| 引用本文： | 翁寿松. 光刻、OPC与DFM[J]. 电子工业专用设备, 2006, 35(4): 18-22 |
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| 作者姓名： | 翁寿松 |
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| 作者单位： | 无锡市罗特电子有限公司,江苏,无锡,214001 |
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| 摘 要： | 讨论了90/65nm芯片设计采用可制造性设计的必要性和优势。介绍了以RET/OPC为核心的可制造性设计。
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| 关 键 词： | 芯片设计 光刻 光学邻近效应校正 可制造性设计 分辨率增强技术 |
| 文章编号： | 1004-4507(2006)04-0018-05 |
| 收稿时间： | 2006-01-10 |
| 修稿时间： | 2006-01-10 |
Lithography, OPC and DFM |
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| WENG Shou-song. Lithography, OPC and DFM[J]. Equipment for Electronic Products Marufacturing, 2006, 35(4): 18-22 |
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| Authors: | WENG Shou-song |
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| Affiliation: | Wuxi Luo Te Electronics Co,. Ltd, Wuxi 214001, China |
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| Abstract: | In this paper, necessity and benefit to adopted design for manufacturing in 90/65 nm chip design are discussed. Design for manufacturing by the core for resolution enhancement technology/optical proximity effect correction is introduced. |
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| Keywords: | Chip design Lithography Optical proximity effect correction(OPC) Design for manufacturing (DFM) Resolution euhancement thchmology(RET) |
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