Leaching of heavy metal elements in solder alloys |
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| Authors: | Cong Qian Cheng Fen Yang Jie Zhao Li Hua Wang Xiao Gang Li |
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| Affiliation: | aSchool of Materials Science and Engineering, Dalian University of Technology, 116085 Dalian, China;bSchool of Materials Science and Engineering, Beijing University of Science and Technology, Beijing 100083, China |
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| Abstract: | Leaching behavior of heavy metal elements from Sn–3.5Ag–0.5Cu, Sn–9Zn, and Sn–37Pb solder alloys and their joints was investigated in typical H2SO4, NaCl and NaOH solutions. The leaching amount of Sn from solder joints was more than that from solder alloys and the leaching amount of Sn from Sn–3.5Ag–0.5Cu solder joint in the NaCl solution was the most. The surface corrosion products on the solder and their joints were composed of oxide, oxide hydroxide or oxychloride of the component element. Much more surface oxides for the samples treated in the NaCl solution produced than that in the NaOH and H2SO4 solutions. |
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| Keywords: | A Electronic materials A Tin C Acid corrosion C Alkaline corrosion |
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