Laboratory scale investigation into the corrosion of copper in a sulphur-containing environment |
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| Authors: | BM Thethwayo AM Garbers-Craig |
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| Affiliation: | Department of Materials Science and Metallurgical Engineering, University of Pretoria, Pretoria 0002, South Africa |
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| Abstract: | The effect of temperature and gas composition on the corrosion rate and corrosion by-product of copper foil was studied by exposing it to sulphur (S2), S2 + hydrochloric acid (HCl) and hydrogen sulphide. The temperature was varied from 80 to 140 °C. Copper foil reacted with S2 to form CuS, Cu9S8 and Cu1.8S. Corrosion rates ranged from 9.6 μm/h at 110 °C to 0.5 μm/h at 140 °C. The presence of HCl caused pitting and enhanced the corrosion rate above 112 °C. Cu2S formed when copper was exposed to hydrogen sulphide gas. Sulphide scale that formed was friable and non-adherent. |
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| Keywords: | A Copper C Sulphidation C Pitting corrosion |
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