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Corrosion behaviour of copper under chloride-containing thin electrolyte layer
Authors:Xiaoning Liao  Fahe Cao  Liyun Zheng  Wenjuan Liu  Anna Chen  Jianqing Zhang  Chunan Cao
Affiliation:aDepartment of Chemistry, Zhejiang University, Hangzhou 310027, PR China;bCollege of Science, Jiangxi Agricultural University, Nanchang 330045, PR China;cState Key Laboratory for Corrosion and Protection, Institute of Metal Research, The Chinese Academy of Sciences, Shenyang 110016, PR China
Abstract:The corrosion behaviour of copper under chloride-containing thin electrolyte layers (TEL) was investigated using electrochemical impedance spectroscopy (EIS), cathodic polarization, linear polarization, SEM/EDS and XRD. The results indicate that the copper corrosion rate increases as TEL thickness decreases during the initial stages. After 192 h of immersion, the corrosion rate of copper under TEL in this order: 300 > 402 > 199 > bulk solution > 101 μm. The corrosion behaviour is uniform under TEL, and pitting is the primary corrosion type in the bulk solution. A corrosion model of the behaviour of copper under chloride-containing TEL is proposed.
Keywords:A  Copper  B  EIS  B  Polarization  C  Atmospheric corrosion
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