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| Sn—Ag—Cu系无铅焊料及其接合可靠性评价 | |
| 引用本文： | 蔡积庆.Sn—Ag—Cu系无铅焊料及其接合可靠性评价[J].印制电路信息,2006,6(3):59-64. |
| 作者姓名： | 蔡积庆 |
| 摘 要： | 概述了Sn-Ag-Cu系无铅焊料及其接合可靠性评价,以及无铅焊料应用的关键点。 |
| 关 键 词： | Sn-Ag-Cu系无铅焊料 接合可靠性评价 流焊 再流焊 |
Sn-Ag-Cu Series Pb-free Solder and Its Soldering Reliability Evaluation |
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| Cai Jiqing.Sn-Ag-Cu Series Pb-free Solder and Its Soldering Reliability Evaluation[J].Printed Circuit Information,2006,6(3):59-64. | |
| Authors: | Cai Jiqing |
| Abstract: | This paper describes the Sn-Ag-Cu series Pb-free solder and its soldering reliability evaluation,and key point of Pb-free solder application. |
| Keywords: | Sn-Ag-Cu series Pb-free solder soldering reliability evaluation flow soldering reflow soldering |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ | |