影响环氧塑封料应力、黏度因素分析及解决

环氧塑封料是微电子工业和技术发展的基础材料， 作为IC后道封装三大主材料之一， 随着IC封装技术的发展， 对其特性的要求愈来愈严格， 尤其对应力、黏度等性能的要求更高。文章简要分析了影响环氧塑封料应力和黏度的因素， 并提出了多个解决方案。通过实验的方式得出数据并加以分析， 通过膨胀系数的数据来反映应力大小， 膨胀系数越小， 在封装过程中产生的应力越小， 不易产生翘曲、分层现象。通过黏度数据大小来反映环氧塑封料流动性能的变化。同时文章还介绍了环氧塑封料膨胀系数和黏度的测试方法。

Analysis the Influenced Elements on EMC's Stress & Viscosity and Related Solution

EMC is one of the important basis of the micro-electronics development, which is one of the three major IC packing materials.With IC packing technology developing,EMC’s property requested more higher , especially such as its press and viscosity;in this paper, Analyze the effective element on the EMC press and viscosity, propose the related solution. Through the experiment, get and analyze the data. Stress is reflected by the CTE. If the CTE is low, then the stress consequently small. In the packaging process, there will be no warpage, delamination. EMC’s flow duration can be reflected by its viscosity. Meanwhile this article give the brief introduction of testing method on CTE and viscosity.