Reduction of mechanical stress in micromachined components caused by humidity-induced volume expansion of polymer layers |
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Authors: | R Buchhold A Nakladal G Gerlach K Sahre K-J Eichhorn M Müller |
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Affiliation: | (1) Dresden University of Technology, Institute of Solid-State Electronics, D-01062 Dresden, Germany, DE;(2) Institute of Polymer Research, Hohe Strasse 6, D-01069 Dresden, Germany, DE |
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Abstract: | Polymer layers frequently used in microsystem technology tend to absorb water from ambient humid air which typically results
in swelling of the polymer layers. Depending on the specific component design, this volume expansion may cause changes in
the mechanical stress, or even displacement of device structures. In most applications, these effects limit performance and
reliability, and should therefore be minimized. The present paper describes an approach for the investigation of swelling
phenomena in thin polymer layers. Polyimide PI2540 was chosen as a model polymer. After extensive characterization of the
polymer layer properties, static and dynamic sorption behavior was investigated by different means. Based on our experimental
results, we have developed linearized models to accurately describe the swelling behavior. Several polymers were characterized.
Although the micro-physical mechanisms responsible for the humidity-induced swelling are still poorly understood, we are –
based on our data – able to effectively reduce humidity induced stress by selecting suitable polymers and optimizing processing
procedures.
Received: 25 August 1997/Accepted: 19 December 1997 |
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Keywords: | microelectronics microsystems polymer layers moisture uptake swelling |
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