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MCM-41的化学修饰及其对Cu2+的吸附性能
引用本文:柏珊珊,岳秀丽,马放,戴志飞.MCM-41的化学修饰及其对Cu2+的吸附性能[J].哈尔滨工业大学学报,2010,42(6):954-957.
作者姓名:柏珊珊  岳秀丽  马放  戴志飞
作者单位:哈尔滨工业大学城市水资源与水环境国家重点实验室;哈尔滨工业大学城市水资源与水环境国家重点实验室;哈尔滨工业大学城市水资源与水环境国家重点实验室;哈尔滨工业大学城市水资源与水环境国家重点实验室
基金项目:国家自然科学基金资助项目(20977021);黑龙江省自然科学基金资助项目(E-2007-12);黑龙江省科技攻关计划资助项目(GC07C104)
摘    要:为了改善介孔分子筛MCM-41的吸附性能,通过两步化学反应依次用3-氨丙基三乙氧基硅烷和一溴代乙酸对其进行化学修饰.采用扫描电镜、接触角、红外光谱等方法对功能化前后的介孔分子筛进行表征.同时,以铜离子为目标污染物,考察了pH值、吸附时间和初始质量浓度对吸附剂吸附性能的影响,探讨了介孔吸附剂对Cu2+的等温吸附特征.实验结果表明:经过羧基化表面修饰后,介孔吸附剂吸附50mg/LCu2+溶液的最佳pH值为6、平衡吸附时间为40min,吸附剂对Cu2+的等温吸附曲线符合经典的Langmuir模型和理论的Freundlich模型,理论最大吸附量为38.46mg/g.

关 键 词:MCM-41  化学修饰  吸附  Cu2+

Removal of Cu(II) ions from contaminated water using chemically modified MCM-41
BAI Shan-shan,YUE Xiu-li,MA Fang and DAI Zhi-fei.Removal of Cu(II) ions from contaminated water using chemically modified MCM-41[J].Journal of Harbin Institute of Technology,2010,42(6):954-957.
Authors:BAI Shan-shan  YUE Xiu-li  MA Fang and DAI Zhi-fei
Affiliation:State Key Laboratory of Urban Water Resource and Environment,Harbin Institute of Technology, Harbin 150090,China;State Key Laboratory of Urban Water Resource and Environment,Harbin Institute of Technology, Harbin 150090,China;State Key Laboratory of Urban Water Resource and Environment,Harbin Institute of Technology, Harbin 150090,China;State Key Laboratory of Urban Water Resource and Environment,Harbin Institute of Technology, Harbin 150090,China
Abstract:Nanostructured material MCM-41 was modified with 3-aminopropyl-triethoxysilane followed by bromoacetic acid. Both modified and unmodified adsorbents were characterized by SEM,contact angle,and FTIR spectroscopy. The Cu(II) adsorption by the modified MCM-41 was investigated. At an initial concentration of 50 mg/L,the optimum conditions for the removal of copper ions were pH of 6 and contact time of 40 min. The kinetics of Cu(II) adsorption of the modified adsorbent could be described by Langmuir model and Freundlich model. The maximum adsorption capacity of Cu(II) was found to be 38. 46 mg/g.
Keywords:MCM-41  chemical modification  adsorption  copper ions
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