| PCB镀通孔疲劳寿命对设计参数的灵敏度分析 |
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| 引用本文： | 孙博,张叔农,谢劲松,张源.PCB镀通孔疲劳寿命对设计参数的灵敏度分析[J].电子元件与材料,2006,25(9):60-63. |
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| 作者姓名： | 孙博 张叔农 谢劲松 张源 |
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| 作者单位： | 北京航空航天大学可靠性工程研究所,北京,100083;深圳华为技术有限公司,广东,深圳,518129 |
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| 摘 要： | 在PCB镀通孔疲劳寿命评估IPC模型的改进模型基础上,分析了镀通孔疲劳寿命对基板厚度与孔径之比(即厚径比l/r0)、基板厚度与镀层厚度之比(l/t)以及基板作用半径与孔半径之比(R/r0)的灵敏度。结果表明,镀通孔疲劳寿命对(l/r0)的灵敏度随(l/t)增大而减小;对(l/t)的灵敏度随(l/r0)增大而减小;而对(R/r0)的灵敏度则随(l/r0)增大而增大、随(l/t)增大而减小。最后,利用IPC的试验研究结果数据进行了验证。
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| 关 键 词： | 电子技术 镀通孔 疲劳寿命 设计参数 灵敏度分析 可靠性 PCB |
| 文章编号： | 1001-2028（2006）09-0060-04 |
| 收稿时间： | 2006-07-27 |
| 修稿时间： | 2006-07-27 |
Sensitivity Analysis for the Dependence of PTH Fatigue Life on PCB Design Parameters |
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| SUN Bo,ZHANG Shu-nong,XIE Jin-song,ZHANG Yuan.Sensitivity Analysis for the Dependence of PTH Fatigue Life on PCB Design Parameters[J].Electronic Components & Materials,2006,25(9):60-63. |
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| Authors: | SUN Bo ZHANG Shu-nong XIE Jin-song ZHANG Yuan |
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| Affiliation: | 1. Institute of Reliability Engineering, Beijing Univ of Aeronautics and Astronautics, Beijing 100083, China; 2. Huawei Technologies Corporation, Shenzhen 518129, China |
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| Abstract: | Based on improved mathematic model of PTH fatigue life evaluation IPC model, sensitivity was analyzed for the dependence of PTH fatigue life on design parameters. The dependence of PTH fatigue life on (l/r0) is found the function of (l/t), also the dependence of PTH life on (l/t) is found the function of (l/r0). While the dependence of PTH life on (R/r0) is the function of both (l/t) an d (l/r0). The IPC test results are used to verify these finding. |
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| Keywords: | PCB |
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