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Reliability analysis of transparent conductive tracks embossed in ZnO and Al-ZnO sol–gel materials
Authors:J. Rao   R.J. Winfield   S. O'Brien  G.M. Crean  
Affiliation:aTyndall National Institute, Lee Maltings, Prospect Row, Cork, Ireland;bDepartment of Microelectronic Engineering, University College Cork, Cork, Ireland
Abstract:In this paper, we present a low-cost rapid replication approach to fabricate ZnO and Al-doped ZnO Transparent Conductive Oxide electrode structures using both hard UV curable polyurethane acrylate and soft thermal curable polydimethylsiloxane moulds. The thin films of the ZnO and Al-ZnO sol–gel precursor solution prepared from zinc acetate monoethanolamine and isopropanol were cast into a polydimethylsiloxane or polyurethane acrylate mould containing the electrode design. For soft mould embossing, the sol–gel coated substrate and polydimethylsiloxane mould were dried under vacuum at 70 °C for 3h. While for hard mould embossing, the system was heated at 150 °C for 30 min with 100 N applying force and then demoulded at 80 °C. The formed electrode patterns can be further densified or annealed giving a stable film that retains the embossed shape. The difference of surface profile obtained by soft and hard moulding is detailed and the hard mould is shown to be more suitable for low aspect ratio conductors. And the reliability study on embossed ZnO and Al-ZnO conductive tracks prepared with hard moulds shows that the embossed structure still retains good quality.
Keywords:Zinc oxide   Moulding   Sol-gel
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